Subject: | |
From: | |
Reply To: | |
Date: | Tue, 12 Dec 2006 11:39:39 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Another aspect on the use of Bismuth:
Bismuth is a 3% by-product from lead-mining.
Peer Langeveld
Consultant Soft Soldering Processes.
2006/12/11, Kerry McMullen <[log in to unmask]>:
> Hello esteemed Technet,
> I am looking comments on what you would consider the advantages and
> disadvantages of this composition of this solder paste. (58Bi/42Sn)
> Lower MP. 138 Degrees C.
> Lower fatigue resistance
> Wetting to ImAg??
> Wetting to ImNiAu??
> No Clean? Residue?
> Intermetallic Formation?
> Mixing with 63/37Sn?
> Our application is an RF board where we would use this paste post Wave /
> Hand Solder.
> Any comments appreciated.
>
> Cheers,
> Kerry
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|