TECHNET Archives

December 2006

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset="US-ASCII"
Sender:
TechNet <[log in to unmask]>
Subject:
58Bi/42Sn
From:
Kerry McMullen <[log in to unmask]>
Date:
Mon, 11 Dec 2006 10:01:06 -0500
MIME-Version:
1.0
X-To:
[log in to unmask]
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (27 lines) 
Hello esteemed Technet,
      I am looking comments on what you would consider the advantages and
disadvantages of this composition of this solder paste. (58Bi/42Sn)
Lower MP.  138 Degrees C.
Lower fatigue resistance
Wetting to ImAg??
Wetting to ImNiAu??
No Clean?  Residue?
Intermetallic Formation?
Mixing with 63/37Sn?
Our application is an RF board where we would use this paste post Wave /
Hand Solder.
Any comments appreciated.

Cheers,
Kerry

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2