Dear All,
 
 
These are 7 terms which are uncertain this afternoon,  please give us your opinions.  : )
 
Thanks and regards 
 
 
Charlotte
 

Depth of Field (Optical)                景深(光学)            24．0361

The range of distances along the axis of an optical instrument, usually a camera lens, through which an object will produce a relatively distinct image.

保持物体产生相对清晰图像时，沿光学仪器，通常为照相机镜头，轴向距离的变化范围。

 

Desmear                                           去钻污                  57.0366

The removal of friction-melted resin and drilling debris from a hole wall.

去除孔壁上的摩擦熔融树脂和钻屑。

 

Diazo Material                                 重氮材料                     24.0371

A nonsilver, room-light hardening, ultraviolet-sensitive coating material.

一种不含银盐的紫外光敏感涂层材料，室内光线下可硬化。

 

Dicyandiamide                                双氰胺                  41.0374

A solid curing agent for epoxy resins.

一种环氧树脂用同质固化剂。

 

Die Attached Pad                           芯片连接盘          35.1688

See "Die Pad."

见“芯片焊盘  Die Pad”

 

Die Shrink                                        芯片缩小              35.1690

Method of reducing silicon area used for the same circuitry by reducing layout feature size by a common percentage for all levels.

按照相同比例，通过减小同一电路各层布局要素尺寸的大小，减小同一电路所用硅片面积的方法。

 

Distance to Neutral Point (DNP)   到中性点距离（DNP）      35.1696

The linear separation of a joint from the neutral point on a chip. This dimension controls the strain on the joint imposed by expansion mismatch between chip and substrate.

接合点到芯片中点的直线距离，这一尺寸可控制由于芯片与基板的膨胀不匹配而在连接点上施加的张力。