We have a 9 pin x .5mm BGA that reguires connection as shown.

The pins are tied together as shown. The soldermask on our first run was
encrouched onto the pads.

This caused the pads to have a eliptical shape instead of a nice round
shape. We did have to do some hand rework on some of

these (arg..boo. hiss).

Questions

1.      Anyone have experience with these that can share what you are doing
for successful fab and assembly?
2.      We are using de-ionized water and water soluable flux to clean
these. Is this the best way to get these cleaned under the part?




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