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November 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 30 Nov 2006 15:53:00 -0800
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Oh are there any issues with lead free then??

http://www.rohsusa.com/blog


John Burke

(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tina Nerad
Sent: Thursday, November 30, 2006 1:31 PM
To: [log in to unmask]
Subject: [TN] CALL FOR PARTICIPATION - IPC/JEDEC Global Conference,
4/17-18/07 in Boston, MA

CALL FOR PARTICIPATION



IPC/JEDEC Global Conference on Lead Free Reliability and Reliability
Testing for RoHS Lead Free Electronics

April 17-18, 2007

Boston, MA



The change to lead free solder has raised issues and problems on the
manufacture, process, and reliability of electronic products. IPC and
JEDEC are seeking speakers to participate in the first global conference
dedicated specifically to addressing the issues of reliability and
reliability testing for lead free electronics.



Presentations from environmental managers and technical staff are sought
on any relevant subjects.  Please cut and paste the following into your
browser for additional information:  www.ipc.org/LFReliability.










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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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