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November 2006

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Subject:
From:
"Bloomquist, Ken" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bloomquist, Ken
Date:
Thu, 2 Nov 2006 13:52:08 -0800
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That's just great; we get to redesign all the circuit boards in the
world in order to be successful at soldering SMT assemblies! No cost
involved there that I can see!

That should be some more cannon fodder for John and "Push Back"!

KennyB

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]] 
Sent: Thursday, November 02, 2006 1:33 PM
To: [log in to unmask]
Subject: Re: [TN] Bizzare Phenomena...

Hi Steve,

Tombstoning is worse for LF-solders than for SnPb.
The surest way of eliminating tombstoning entirely is by eliminating the
fillets--make the pads the same size as the metallization on the CC
underside [or
just slightly larger]. No more tombstoning, no more CC cracking and more
reliable solder joints as well because you wind up with more solder
joint height.

Werner

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