Hi Irving,
To my knowledge, there is nothing you can do to entirely eliminate voids in
the solder fill of PCB via barrels; that is the reason why most people tent or
fill the vias with some resin.
Voids in the solder fill of PCB via barrels create stress concentrations that
can precipitate barrel cracking at that point. HOWEVER, this is a reliability
problem of significance only in applications where the operational thermal
excursions exceed delta-T of ~50C and/or any subsequent repair/rework
operations.



Werner

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