1. Are any of these fixable?
No, they are not fixable.  The one thing that you could do is determine if
the delam after the hand soldering is a function of the lot of boards or the
hand soldering process.  The ground planes in the board present a problem when
pre-baking, but you can pre-bake to remove the moisture between the ground plane
layers.

  2. Would you try, or would you just let them go, or would you scrap them?
The boards have to be scrapped, in my opinion, since you now know the extent
of the delamination within the board.

  3. Can someone interpret what IPC-A-600 means by:
  -The blister or delamination does not span more than 25% of the distance
between adjacent conductive patterns.
  (adj patterns on the same layer as the delam, or adj patterns on any layer
in the board or ...?)  For instance, dctest2.jpg spans the conductive patterns
on the top layer, but the delam is on an internal layer (of course).
IPC-A-600 addresses a bare board.  The requirements in it are for bare boards
PRIOR to any thermal stressing for blisters and delamination.  Since the
condition was propagated by the thermal stressing of the soldering process, that
alone makes it non-compliant.

Susan Hott
Robisan Lab

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