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November 2006

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Subject:
Re: ENIG roughness
From:
Anil Kher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 30 Nov 2006 12:11:11 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (53 lines) 
 IPC 6012 - 3.5.4.3 - WBP ( wire bond pads) permitted roughness is 0.8
microns RMS.

This is the only roughness classification I know.

Anil Kher

-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Thursday, November 30, 2006 1:55 AM
Subject: ENIG roughness

Well, now I also have a question. I hope it's not going to be a tricky one
:-) The question is: "Is there a spec for the surface roughness of ENIG
finish"?


Thanks a lot in advance.

Regards,

Vladimir

AMD

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