Vladimir,
The IPC spec for ENIG did not address surface morphology of ENIG.
There is a lot of discussion within the plating committee at this  time about
the topography/morphology of the copper surface before plating  the surface
finish.

The consensus at the moment is that the preferred surface for plating the
finish should be smooth. This is not always achieved as the copper surface comes
 to the surface finish plating line after solder-mask (SM)application.  To
achieve good SM adhesion the surface is micro -roughened.  Most  pre-treatment
includes a micro-etch step, hopefully this step can smoothen the  copper
surface to some degree.

The electroless Ni deposit has a unique morphology, however it does reflect
the underlying copper morphology.  Smoother Ni is harder to corrode.

Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874

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