The only work we've published was done Paper #12 at CMAP 2
Ioan,
The only work we've published was done Paper #12 at CMAP 2006.
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer
Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Tuesday, November 28, 2006 9:04 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
George,
I'm sure you went way beyond the solder paste recommendations and you
did serious testing to confirm the reliability of the joints. If not
confidential, what was the testing you guys did?
Thanks,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Tuesday, November 28, 2006 8:32 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
No more so that soldering a SnPb BGA with SnPb solder p Richard,
No more so that soldering a SnPb BGA with SnPb solder paste. The BGA's
with Pb-Free balls that we've soldered using SnPb solder paste were
assembled using the component vendor reflow profiles. We've worked very
closely with our strategic component suppliers and try very hard not to
violate any of their assembly recommendations. It hasn't happened to us
yet but if a component vendor was not willing to work with us they most
likely would not be put on our strategic vendor list.
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
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