George,

I'm sure you went way beyond the solder paste recommendations and you did serious testing to confirm the reliability of the joints. If not confidential, what was the testing you guys did?

Thanks,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wenger, George M.
Sent: Tuesday, November 28, 2006 8:32 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly


No more so that soldering a SnPb BGA with SnPb solder p
Richard,

No more so that soldering a SnPb BGA with SnPb solder paste. The BGA's
with Pb-Free balls that we've soldered using SnPb solder paste were
assembled using the component vendor reflow profiles.  We've worked very
closely with our strategic component suppliers and try very hard not to
violate any of their assembly recommendations.  It hasn't happened to us
yet but if a component vendor was not willing to work with us they most
likely would not be put on our strategic vendor list.


Regards, 
George 
George M. Wenger 
Senior Principle FMA / Reliability Engineer 
Wireless network Solutions 
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask] 

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