George,
If you heat up the SAC part and solder it to an assembly using 63/37
solder, is that any less of a "modification" than if you heat up the
part and solder the 63/37 balls to it?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, November 27, 2006 8:19 PM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
I don't disagree with the points you raise e Bob,
I don't disagree with the points you raise especially the point that one
has to weigh all of the risks and make an informed risk assessment. If
we were making tens/hundreds of products with hundred/thousand collar
devices we might make the decision to pay the $25-50 national reballing
price. However, when you're making thousands/ tens of thousands of
products with $50-100 dollar devices the $25-50 national reballing price
is not a pittance. My reference to voiding the warranty wasn't made
because of the number of heat cycles a component vendor warrants it was
made because most component vendors have indicated that if we modify
their component in any fashion we void the warranty.
I don't mean to indicate that reballing is "bad" and creates un-reliable
product because if it was there won't be any companies providing
reballing service. I do mean to indicate that we've done an internal
risk assessment based on analysis and evaluations that indicates we can
provide a quality/reliable product without the need for reballing.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
_____
From: bob wettermann [mailto:[log in to unmask]]
Sent: Monday, November 27, 2006 4:19 PM
To: TechNet E-Mail Forum; Wenger, George M.
Subject: Re: [TN] FW: [TN] BGA anomaly
Hi George:
We are a reballing service provider. While we have been involved in
internal reliability testing on specific parts we have yet to see any
published papers on the topic-has anyone else seen such a study
completed and reported on?
In terms of the reballing being expensive it depends on the value of the
device. For a several hundred/thousand dollar device the $25-50 national
reballing price seems like a pittance. The situation is not even a cost
issue if parts are not obtainable at any price and you have to ship
finished goods. (After one has weighed all of the risks)
The warranty stating no more than 3 heat cycles from most manufacturers
can and has been violated by the thousands of users who have reballed
parts since the advent of this package type. Again, this a risk vs cost
issue.
Regards
Bob Wettermann
By the way if anyone wants to be involved in such a study we would be
happy to work with you as long as the results can be reported publicly.
"Wenger, George M." <[log in to unmask]> wrote:
There are three issues with re-balling BGA's:
1. It
Ramon,
There are three issues with re-balling BGA's:
1. It is expensive
2. You void the component manufacturers warranty 3. It is a solder
repair/replacement process that requires two heating operations(removal
and Replacement)
The reason we do not re-ball is because of 2 & 3. Anytime you do a
repair process you can introduce reliability issues and when it is
compounded by losing the warranty we decided not to reball
Regards,
George
George M. Wenger
Senior Principle FMA / Reliability Engineer Wireless network Solutions
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Monday, November 27, 2006 8:47 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
Hi George:
" c). Do not re-ball Pb-Free area array packages with SnPb balls."
Do you recommend not to reball SAC balls even if the solder paste to be
used is SnPb and Pb profiles? Could you expand the matter?
Thanks for your inputs.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Monday, November 27, 2006 4:57 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
Many thanks all for your responses, the team have come good again!
I guess I wasn't far off the mark then, looks like some discussions with
the Design Team are order of the day!
Regards,
Iain.
-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: 24 November 2006 15:49
To: TechNet E-Mail Forum; Braddock, Iain
Subject: RE: [TN] FW: [TN] BGA anomaly
Iain,
You've stated correctly the dilemma companies are facing. You've
comment/question about option 2 creating a reliability concern and also
invalidating the manufacturers warranty is also correct. Companies are
going to have to make their own risk assessments. Unfortunately, many of
those decisions are not knowledge based decisions because there isn't
good documented information available. The recommendations I've made
internally are:
1. Use SnPb assembly whenever possible
2. Use Pb-Free components and processes when product needs to be RoHS
6/6 compliant.
3. When forced into mixed alloy assembly:
a. For RoHS 6/6 product, use Pb-Free processes (245-260C) when all
components are compatible with Pb-Free processes.
b). For RoHS 5/6 product, use maximum SnPb process temperatures
(225- 235C) whenever there are components not compatible with Pb-Free
processes (i.e., don't exceed the maximum temperature the MSL was tested
at by the component vendor.
c). Do not re-ball Pb-Free area array packages with SnPb balls.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA /
Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell] -----Original
Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Friday, November 24, 2006 7:43 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
This sure is an interesting dilemma!
So which is the lesser of the two evils assuming you are forced into it
with the Design?
1) SnPb / SAC BGA's with a temperature profile (230ish) that allows all
joints to go liquidus.
2) Reball SAC BGA's with SnPb balls & use standard SnPb thermal profile.
If option 2 does that not create reliability concerns also invalidate
the manufacturers warranty?
Regards,
Iain.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: 22 November 2006 17:39
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
*** WARNING ***
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Keep this in mind if you answer this message.
Hi Ramon,
Mixing SnPb with SAC is not a very good idea--you are right.
Werner
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