Hi George:
" c). Do not re-ball Pb-Free area array packages
with SnPb balls."
Do you recommend not to reball SAC balls even if the solder
paste to be used is SnPb and Pb profiles? Could you expand the matter?
Thanks for your inputs.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Monday, November 27, 2006 4:57 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
Many thanks all for your responses, the team have come good again!
I guess I wasn't far off the mark then, looks like some discussions with
the Design Team are order of the day!
Regards,
Iain.
-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: 24 November 2006 15:49
To: TechNet E-Mail Forum; Braddock, Iain
Subject: RE: [TN] FW: [TN] BGA anomaly
Iain,
You've stated correctly the dilemma companies are facing. You've
comment/question about option 2 creating a reliability concern and also
invalidating the manufacturers warranty is also correct. Companies are
going to have to make their own risk assessments. Unfortunately, many
of those decisions are not knowledge based decisions because there isn't
good documented information available. The recommendations I've made
internally are:
1. Use SnPb assembly whenever possible
2. Use Pb-Free components and processes when product needs to be RoHS
6/6 compliant.
3. When forced into mixed alloy assembly:
a. For RoHS 6/6 product, use Pb-Free processes (245-260C) when
all components are compatible with Pb-Free processes.
b). For RoHS 5/6 product, use maximum SnPb process temperatures
(225- 235C) whenever there are components not compatible with
Pb-Free processes (i.e., don't exceed the maximum
temperature the MSL was tested at by the component vendor.
c). Do not re-ball Pb-Free area array packages with SnPb balls.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA /
Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell] -----Original
Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain
Sent: Friday, November 24, 2006 7:43 AM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
This sure is an interesting dilemma!
So which is the lesser of the two evils assuming you are forced into it
with the Design?
1) SnPb / SAC BGA's with a temperature profile (230ish)
that allows all joints to go liquidus.
2) Reball SAC BGA's with SnPb balls & use standard SnPb
thermal profile.
If option 2 does that not create reliability concerns also invalidate
the manufacturers warranty?
Regards,
Iain.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: 22 November 2006 17:39
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly
*** WARNING ***
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Hi Ramon,
Mixing SnPb with SAC is not a very good idea--you are right.
Werner
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