That was nicely and concisely summarized George.

Best regards,
Joe




In a message dated 11/24/2006 7:51:25 A.M. Pacific Standard Time,
[log in to unmask] writes:

You've  stated correctly the dilemma companies are facing.   You've
comment/question about option 2 creating a reliability concern and  also
invalidating the manufacturers warranty is also correct.   Companies are
going to have to make their own risk assessments.   Unfortunately, many
of those decisions are not knowledge based decisions  because there isn't
good documented information available. The  recommendations I've made
internally are:

1. Use SnPb assembly  whenever possible
2. Use Pb-Free components and processes when product  needs to be RoHS
6/6 compliant.
3. When forced into mixed alloy  assembly:
a. For RoHS 6/6 product, use Pb-Free processes  (245-260C) when
all         components are compatible  with Pb-Free processes.
b). For RoHS 5/6 product, use maximum  SnPb process temperatures
(225-        235C) whenever  there are components not compatible with
Pb-Free        processes (i.e., don't exceed the maximum
temperature the MSL    was tested at by the component vendor.
c). Do not re-ball Pb-Free area array packages with SnPb  balls.








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