TECHNET Archives

November 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Fri, 24 Nov 2006 12:42:53 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (61 lines)
This sure is an interesting dilemma!

So which is the lesser of the two evils assuming you are forced into it with the Design?

        1)      SnPb / SAC BGA's with a temperature profile (230ish) that allows all joints to go liquidus.
        2)      Reball SAC BGA's with SnPb balls & use standard SnPb thermal profile.

If option 2 does that not create reliability concerns also invalidate the manufacturers warranty?

Regards,
        Iain.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: 22 November 2006 17:39
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly


               *** WARNING ***

This mail has originated outside your organization,
either from an external partner or the Global Internet. 
     Keep this in mind if you answer this message. 

Hi Ramon,
Mixing SnPb with SAC is not a very good idea--you are right.



Werner

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------


********************************************************************
This email and any attachments are confidential to the intended
recipient and may also be privileged. If you are not the intended
recipient please delete it from your system and notify the sender.
You should not copy it or use it for any purpose nor disclose or
distribute its contents to any other person.
********************************************************************

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2