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November 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Wed, 22 Nov 2006 12:56:46 -0500
Content-Type:
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text/plain (111 lines)
 
    Denny:
    I got the article in an acrobat form. Yes I intended to let you know
where this info came from.  Copied the most relevant info of a very long
interesting article based on test made using coupons that provided
information about different sources of voids.. 
       Regards,
    Ramon
 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, November 22, 2006 12:37 PM
To: [log in to unmask]; Dehoyos, Ramon
Subject: Re: [TN] Silver Plating


Ramon - did you intend to post the commercial information at the start
of your e-mail???
 
Anyway, thanks for the market information - do you mean Cookson supplied
it from the three sources you listed?
 
Denny Fritz
MacDermid, Inc  
 
 
-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Wed, 22 Nov 2006 9:07 AM
Subject: [TN] Silver Plating


        FYI


        Alpha STAR(r)
High Performance Immersion Silver for
Lead-Free Soldering
Consistent reliability in a lead-free circuit board finish just reached
a new level
Includes Alpha STAR Results on Planar Micro void
Issued / Revised: Aug 25, 2006



Surface Finishes Market Trends:

Projected Global Growth and Changes in the Market:  HASL 57%, OSP 20%,
ENIG 14%, ImSn 3% and ImAg 6%  
Projected to be:                                    HASL 37%, OSP 28%,
ENIG 14%, ImSn 4% and ImAg 17% 

CAGR 2004 Global Finish Volume 2008 Global Finish Volume Board Sqft CAGR
HASL -4.4% OSP 14.5% ImAg 42% ImSn 22% ENIG 5.7%

Source: Internal, Prismark, IPC/TMRC*Immersion Silver and OSP will grow
at the expense of HASL and ENIG

*HASL will decline due to the non-uniform planarity, poor cleanliness,
high layer count yield loss, Pb-free cost increase, lack of Pb-free
process development, and industry support

*ENIG high priced contact finish niche will continue, but "Black
Pad"fear, assembler liability issues, and costs pressures will lead to
decline*Immersion 

Tin growth is less clear, press fit preferred, but limited by
inconsistent shelf life, long process time, tin whisker fear and solder
mask compatibility

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