Ramon - did you intend to post the commercial information at the start of your e-mail???

Anyway, thanks for the market information - do you mean Cookson supplied it from the three sources you listed?

Denny Fritz
MacDermid, Inc


-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Wed, 22 Nov 2006 9:07 AM
Subject: [TN] Silver Plating


        FYI


        Alpha STAR(r)
High Performance Immersion Silver for
Lead-Free Soldering
Consistent reliability in a lead-free circuit board finish just reached
a new level
Includes Alpha STAR Results on Planar Micro void
Issued / Revised: Aug 25, 2006



Surface Finishes Market Trends:

Projected Global Growth and Changes in the Market:  HASL 57%, OSP 20%,
ENIG 14%, ImSn 3% and ImAg 6%
Projected to be:                                    HASL 37%, OSP 28%,
ENIG 14%, ImSn 4% and ImAg 17%

CAGR 2004 Global Finish Volume 2008 Global Finish Volume Board Sqft CAGR
HASL -4.4% OSP 14.5% ImAg 42% ImSn 22% ENIG 5.7%

Source: Internal, Prismark, IPC/TMRC*Immersion Silver and OSP will grow
at the expense of HASL and ENIG

*HASL will decline due to the non-uniform planarity, poor cleanliness,
high layer count yield loss, Pb-free cost increase, lack of Pb-free
process development, and industry support

*ENIG high priced contact finish niche will continue, but "Black
Pad"fear, assembler liability issues, and costs pressures will lead to
decline*Immersion

Tin growth is less clear, press fit preferred, but limited by
inconsistent shelf life, long process time, tin whisker fear and solder
mask compatibility

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