Hi Werner:
                  You are right, thanks for correcting me. At SAC
profiles the SAC ball and the SnPb should melt together. On the other
hand, there are plenty of papers written about the negatives of mixing
SAC and SnPb. Don't you agree that it is not a good combination? One
more thing, Flux for SnPb is formulated to withstand SnPb profiles and
not SAC profiles. 
        Regards,
        Ramon 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, November 20, 2006 3:00 PM
To: [log in to unmask]
Subject: Re: [TN] FW: [TN] BGA anomaly

Hi Ramon,
Something sure got mixed-up somewhere. You say "BGA ball-solder
interface"; there is no such thing in a properly soldered SJ, and there
certainly are no IMCs there.. 
Some people have referred to this 'interface' on solder joints that did
not get hot enough for the solder volume to join up-and there may be
some flux remains there, but that is not the root cause.

Werner

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