Hello Amol
We would dip tin the parts.
Can the connector manufacturer tell you how much gold they are
applying? If so you could throw that into an equation and calculate the
volume.
But the catch is the "documented evidence available for review that
there are no gold related solder embrittlement problems associated with
the soldering process being used"... (J-STD-001D 3.9.3)
I would interpret that as meaning that I have to have tested that
particular part/assembly process combination, and found it acceptable
for use. For us that would mean subjecting it to the qualification
testing we normally put our products though, at a minimum. Hence - we
will find it cheaper and easier to tin it.
regards,
Graham Collins
Process Engineer,
L-3 Communications Electronic Systems Inc.
Halifax
(902) 873-2000 ext 6215
>>> [log in to unmask] 11/02/06 01:42PM >>>
Dear Technetters,
One of the connectors that we use in an exempt application just went
lead free. The surface finish on the connector is gold over nickel. One
end of the connector is soldered to the board by tin lead solder, while
the other end goes into a PTH and is hand soldered, again using tin-lead
solder. How can I be sure that gold embrittlement will not be an issue
for this joint? Is there a minimum % of gold that needs to be present in
the solder joint for this to become an issue?
If I know the gold plating thickness, pin dimensions, and the PTH
dimensions, can I figure out how much gold % would be in the joint, and
hence objectively conclude one way or the other? What other information
do I need?
Regards,
Amol
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