Prashant-

Main problem is simply solder masking the track between the pads.  Most
board fab houses will want 3mils of "backoff" for generating the solder
mask artwork.  This allows a 3mil targeting error between the mask and
the metal.  With 3mils on each side, that means the maximum gap can be
6mils from a pad to an adjacent trace (3mils target error plus 3 mils
backoff) .  So as long as its greater than 6mils from each pad to the
edge of the trace, any reputable place can build the board and assure
that the track will be fully masked.

You can get higher resolution, but you will have to pay significantly
more for it.

Wayne Thayer

>>> [log in to unmask] 11/21/2006 12:56:11 am >>>
Hi,

  I need your expert opinion on this. The design team here wants to put
a 6mil track in between the pads of the connector on the component side.
Its an 80 pin dual connector and they need to take out these 6 mils
track in between every two pads of the connector.(ie in all 20 tracks on
each side of the connector).

  Is this an issue of DFM violation? Will it have an impact on the
stability,placement  and soldering of the connector thru reflow? Any
process or reliability issues which we can foresee?

  I am attaching the data sheet of the connector. It is also having two
boss pins for placement guiding.

  Thanks in advance for expert opinions from all of you.

  Regards
  Prashant Chopra
  Manufacturing Process & Projects Engineer


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