TECHNET Archives

November 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
Date:
Thu, 2 Nov 2006 12:49:35 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (61 lines)
pre-tin the soldering area..(unless you got flash of gold <8 u-inch)

abcd

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kane, Amol (349)
Sent: Thursday, November 02, 2006 12:42 PM
To: [log in to unmask]
Subject: [TN] Gold Embrittlement


Dear Technetters,
One of the connectors that we use in an exempt application just went lead
free. The surface finish on the connector is gold over nickel. One end of
the connector is soldered to the board by tin lead solder, while the other
end goes into a PTH and is hand soldered, again using tin-lead solder. How
can I be sure that gold embrittlement will not be an issue for this joint?
Is there a minimum % of gold that needs to be present in the solder joint
for this to become an issue?
If I know the gold plating thickness, pin dimensions, and the PTH
dimensions, can I figure out how much gold % would be in the joint, and
hence objectively conclude one way or the other? What other information do I
need?
Regards,
Amol



CONFIDENTIALITY NOTICE:
This e-mail, and any attachments, is for the sole use of the intended
recipient(s) and may contain information that is confidential and
protected from disclosure under the law. Any unauthorized review, use,
disclosure, or distribution is prohibited. If you are not the intended
recipient, please contact the sender by reply e-mail, and delete/destroy
all copies of the original message and attachments.
Thank you.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2