-----Original Message-----
From: Dehoyos, Ramon
Sent: Monday, November 20, 2006 2:34 PM
To: 'Wenger, George M.'
Subject: RE: [TN] BGA anomaly
Hi Wenger:
Based on several articles, the BGA ball-solder interface. The
intermetalics at that interface make the area fragile and it cracks.
Regards,
Ramon
-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Monday, November 20, 2006 2:27 PM
To: TechNet E-Mail Forum; Dehoyos, Ramon
Subject: RE: [TN] BGA anomaly
Ramon,
Crack at what interface?
Richard,
If "lead-rich zones within the finished solder joint that are
undesirable" what makes them undesirable in a SnPb solder joint?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Monday, November 20, 2006 1:50 PM
To: [log in to unmask]
Subject: Re: [TN] BGA anomaly
The question is: are there 63/37 SnPb paste with flux that can
endure LF profiles? Or will the flux burn out and leave dull solder
joints? SAC305 balls and 63/37 do not make reliable SJs. There is a
tendency to crack at the interface.
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, November 20, 2006 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] BGA anomaly
Werner is correct, and my two cents worth; the profile must be of such
duration to ensure that the lead in the solder joint is properly
homogenized within the solder joint. Else you will have lead-rich zones
within the finished solder joint that are undesirable.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, November 20, 2006 9:06 AM
To: [log in to unmask]
Subject: Re: [TN] BGA anomaly
Hi Iain,
For a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305)
using a
63/37 SnPb solder, the preferred reflow profile is definitely a LF-SAC
profile, NOT a SnPb-profile.
Werner
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