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November 2006

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Subject:
Re: BGA anomaly
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 20 Nov 2006 11:36:40 -0600
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text/plain
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Werner is correct, and my two cents worth; the profile must be of such
duration to ensure that the lead in the solder joint is properly
homogenized within the solder joint. Else you will have lead-rich zones
within the finished solder joint that are undesirable. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, November 20, 2006 9:06 AM
To: [log in to unmask]
Subject: Re: [TN] BGA anomaly

Hi Iain,
For a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305)
using a
63/37 SnPb solder, the preferred reflow profile is definitely a LF-SAC
profile, NOT a SnPb-profile.

Werner

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