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Date: | Mon, 20 Nov 2006 15:56:04 -0000 |
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Ioan,
Thanks for the report, it backed up what I have picked up on previously.
Regards,
Iain.
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: 20 November 2006 13:06
To: Braddock, Iain
Subject: RE: [TN] BGA anomaly
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Iain,
this is the only reference I have come across.
Good luck,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Braddock, Iain
Sent: Monday, November 20, 2006 6:48 AM
To: [log in to unmask]
Subject: Re: [TN] BGA anomaly
Not sure I worded this question so will ask again a slightly different way as I didn't get any responses.
If one is reflow soldering ENIG boards with a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder what would be the preferred peak temp / time above?
Regards,
Iain.
-----Original Message-----
From: Braddock, Iain
Sent: 17 November 2006 08:35
To: [log in to unmask]
Subject: RE: [TN] BGA anomaly
Joyce,
I can't say it is preferable but how does one solder a board using SnPb solder with the odd PbF part whilst trying to ensure the profile will provide sufficient time above Solidus (Werner see I've learned!) to enable a satisfactory soldered joint?
Regards,
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