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November 2006

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From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Mon, 20 Nov 2006 15:56:04 -0000
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Ioan,



Thanks for the report, it backed up what I have picked up on previously.



Regards,

	Iain.



-----Original Message-----

From: Tempea, Ioan [mailto:[log in to unmask]]

Sent: 20 November 2006 13:06

To: Braddock, Iain

Subject: RE: [TN] BGA anomaly





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Iain,



this is the only reference I have come across.



Good luck,



Ioan







-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Braddock, Iain

Sent: Monday, November 20, 2006 6:48 AM

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly







Not sure I worded this question so will ask again a slightly different way as I didn't get any responses.



If one is reflow soldering ENIG boards with a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder what would be the preferred peak temp / time above?



Regards,

	Iain.



-----Original Message-----

From: Braddock, Iain 

Sent: 17 November 2006 08:35

To: [log in to unmask]

Subject: RE: [TN] BGA anomaly





Joyce,



I can't say it is preferable but how does one solder a board using SnPb solder with the odd PbF part whilst trying to ensure the profile will provide sufficient time above Solidus (Werner see I've learned!) to enable a satisfactory soldered joint?



Regards,



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