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November 2006

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Subject:
Re: BGA anomaly
From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Mon, 20 Nov 2006 11:36:11 -0000
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Werner,
 
Would there be any potential reliability concerns with either of the components warpages assuming that I could get rid of the bridging?
 
Regards,
    Iain.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 16 November 2006 14:54
To: Braddock, Iain; [log in to unmask]
Subject: Re: [TN] BGA anomaly


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In a message dated 11/16/06 6:19:19, [log in to unmask] writes:


So it would appear that one BGA curled up and the other curled down....with different amounts of collapse.........hmm?




The answer likely lies with the different Solidus temperatures for the 2 solders [217 vs. 183C] at which these solders freeze to a rigid connection.

Werner




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