We have a product with mixed surface finishes-Electrolytic Ni/Au(
Hi,
 
We have a product with mixed surface finishes-Electrolytic Ni/Au(Au thickness: ca. 12~20 micro-incheses; Hard gold Au-Co alloy) + ENIG(Electroless Nickel/Immersion Gold).  Because of customer's request, electrolytic Ni/Au has to be completed before patteren formation. Following electrolytic Ni/Au process, the manufacturing process for this board would pass through H2O2/H2SO4, SES(dry film striper-Copper-ammonia solution-Tin striper) and SPS(Na2S2O8) etching solution.  At final visual inspection, several Au surface defects were found.  Failure mode analysis shows a 2~10 micro-meters diameter round hole by SEM.  Cross-section shows that Ni was corroded and Cu was etched in severe defect.  We think these defects were qwing to Au porosity issue.  We carried out active carbon filtration for Ni & Au bath.  But the electrolytic Ni/Au quality could not keep in a stable level.  The defect rate was from 6~20%.  Does anyone have any experience or idea on this case?

Thanks
 
Leo

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