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November 2006

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From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Fri, 17 Nov 2006 08:34:57 -0000
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Joyce,



I can't say it is preferable but how does one solder a board using SnPb solder with the odd PbF part whilst trying to ensure the profile will provide sufficient time above Solidus (Werner see I've learned!) to enable a satisfactory soldered joint?



Regards,

	Iain. 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Joyce Koo

Sent: 16 November 2006 15:34

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly





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Are you sure you want SnPb at 74 sec with peak of 232 C (232-183=49 C)...



abcd 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier

Sent: Thursday, November 16, 2006 9:51 AM

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly





In a message dated 11/16/06 6:19:19, [log in to unmask] writes:

> The reflow profile peaked @ 232C with time above liquidus for, 1) SAC - 29 

> secs 2) SnPb - 74 secs.

> 

Where did you get "time above liquidus"--I think you mean "time above Solidus"

—which is an entirely different thing.



Werner



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