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November 2006

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Subject:
From:
"valerie St. Cyr" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 16 Nov 2006 17:39:06 -0500
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Dear Technetters ... thank you all for sharing.

I am very familiar with the different tests, how they work, what they
test, when I might want to use one over another one ... what I was trying
to do was follow a thread.

Werner, I have read your paper and you say "The glass transition
temperature should be determined using the Thermo-Mechanical Analysis
(TMA) method as per IPC-TM-650, 2.4.24c. The TMA method is preferred ..."

Also, Cameron Murray wrote in his Technical Paper, published by the IPC,
and presented at IPC Printed Circuits Expo 1998, titled: Testing and
Evaluation of HDIS Materials: "The IPC4104 committee has decided the
preferred method for determining CTE and Tg is by use of a thermal
mechanical analyzer (TMA)."

So, I was only trying to find out if there was an official position or
white paper from the IPC or an IPC committee.

I have been specifying TMA for Tg for 20 years ... there are a few on this
forum who go back with me to the old Digital Equipment Corp days, and way
back then when we broke into 10 layer boards! that were .093 thick! we did
an extensive round robin study of the 3 methods then correlated findings
with 3 independent commercial labs ... so, you don't need to sell me. I
was just looking to see, based on some people using the letters TMA close
to the words IPC and "preferred", if there was a direct link.


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Following Werner's response I conclude that there isn't ....

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