Dear Tech Netters,

I have read that "IPC recommends" TMA for Tg determination (vs DSC or
DMA).

I have searched the site for a White Paper without finding one; I have
reread both specs looking for any language which would seem to imply one
is better than the other for determination of Tg given that the test is
one that reacts to thermal inputs, making it perhaps a more useful test
wrt to assessing thermal robustness given lead free assembly.

I am not trying to establish the differences between the tests. I am
trying to establish if IPC is on record somewhere with a recommendation or
preference.

Anyone know?

Thanks, Valerie

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