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November 2006

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Subject:
Re: Separation in BGA joints
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Thu, 16 Nov 2006 11:29:16 -0500
Content-Type:
text/plain
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text/plain (128 lines) 
I seriously doubt that the content of Cu was analyzed from a
cross-sectioned sample. That would be weird. In addition, the Ioan's
picture doesn't look like a typical "head in pillow" case. In fact, I
think it's a completely different thing.

Regards,

Vladimir

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Thursday, November 16, 2006 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] Separation in BGA joints

Right on!!!   I agree totally.


Regards
Gaby,

Right on!!!   I agree totally. 


Regards, 
George 
George M. Wenger 
Senior Principle FMA / Reliability Engineer 
Wireless network Solutions 
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask] 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent: Thursday, November 16, 2006 11:04 AM
To: [log in to unmask]
Subject: Re: [TN] Separation in BGA joints

IMHO the analysis of copper more than standard SAC may be caused by the
cross section preparation, smearing, etc.
Head in pillow it is and check the following:
http://alphametals.com/products/solder_solutions/pdf/pillowhead.pdf
Gaby

----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 15, 2006 11:20 PM
Subject: Re: [TN] Separation in BGA joints


> Hi Vladimir,
> Certainly, more solder paste would have helped; but IMHO is is still 
> the temperature being too low.
>
>
>
> Werner
>
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