TECHNET Archives

November 2006

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Copper Dissolution
From:
Irving Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 3 Nov 2006 00:06:43 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines) 
Corey,

Thanks. It is very worth recommendation. What kind of flux type you recommend ?
ENIG is not allowed by our customers, we may need to try other finishing types .

Irving

-----Original Message-----
From: Corey A Peterson [mailto:[log in to unmask]] 
Sent: Thursday, November 02, 2006 11:55 PM
To: TechNet E-Mail Forum; Lee, Irving (§õ©ú©ô TAO)
Subject: Re: [TN] Copper Dissolution


Irving , 

There are several options here. 

1) Use an ENIG surface finish
2) Use a flux that is a bit more aggressive probably will need some rosin to give it enough legs" to last in the wave that long.  Avoid using the chip wave if possibly.  You are going to be hard pressed to find a flux that will last that long thru the wave solder pot. 
3) Specific minimum copper thickness for the knee 
4) Change solder pot to a less aggressive solder alloy   
5) Use the best thermal mitigation strategies and where possibly use bigger annular rings. 

Corey Peterson 



Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to [log in to unmask] 

Sent by:        TechNet <[log in to unmask]> 

To:        [log in to unmask] 
cc:         

Subject:        [TN] Copper Dissolution 

 
How to avoid copper dissolution during lead free wave soldering ?

[1] Printed Circuit Board Size : 13"x16" , Thickness : 0.93"
[2] Lead Free  Solder Bar Type : SAC = Sn + 3 % Ag + 0.5 % Cu [3] Both sides Reflow prior to Wave Soldering [4] Wave time : 6 sec , Temperature : 265 degree C


Irving Lee

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2