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November 2006

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Wed, 15 Nov 2006 22:36:24 +0200
Content-Type:
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text/plain (43 lines)
I suggest to check if it hidden pillow phenomenon 

I have to see the cross section before.

Best Regards
Reuven ROKAH 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Wednesday, November 15, 2006 10:31 PM
To: [log in to unmask]
Subject: Re: [TN] Separation in BGA joints

If the melting point is 270 C, as you checked then I completely agree.

Regards,

Vladimir

-----Original Message-----
From: [log in to unmask]
To: Vladimir Igoshev; [log in to unmask]
Sent: Wed Nov 15 15:20:53 2006
Subject: Re: [TN] Separation in BGA joints

Hi Vladimir,
Certainly, more solder paste would have helped; but IMHO is is still the
temperature being too low.



Werner

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