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November 2006

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 15 Nov 2006 14:11:49 EST
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Hi Tony,
I am a consultant—so my data base is the incidents of clients needing help 
with issues. I certainly have seen an increase in "wetting problems, 
delamination, reduced component reliability, open vias and copper pads dissolving away 
during soldering and rework, great increases in tombstoning and spattering," but 
this certainly does not represent a scientifically valid data base, enen 
though, there is nothing "hypothesized" about it.

Werner

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