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November 2006

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Subject:
From:
Corey A Peterson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Corey A Peterson <[log in to unmask]>
Date:
Thu, 2 Nov 2006 09:55:00 -0600
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Irving ,

There are several options here.

1) Use an ENIG surface finish
2) Use a flux that is a bit more aggressive probably will need some rosin
to give it enough legs" to last in the wave that long.  Avoid using the
chip wave if possibly.  You are going to be hard pressed to find a flux
that will last that long thru the wave solder pot.
3) Specific minimum copper thickness for the knee
4) Change solder pot to a less aggressive solder alloy
5) Use the best thermal mitigation strategies and where possibly use
bigger annular rings.

Corey Peterson


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Subject:        [TN] Copper Dissolution


How to avoid copper dissolution during lead free wave soldering ?

[1] Printed Circuit Board Size : 13"x16" , Thickness : 0.93"
[2] Lead Free  Solder Bar Type : SAC = Sn + 3 % Ag + 0.5 % Cu
[3] Both sides Reflow prior to Wave Soldering
[4] Wave time : 6 sec , Temperature : 265 degree C


Irving Lee

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