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November 2006

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Subject:
From:
"Kane, Joseph E (US SSA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Joseph E (US SSA)
Date:
Wed, 15 Nov 2006 12:20:24 -0500
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Guys, need some help.  We've got a dispute about how lead spacing
is dimensioned according to the JEDEC specs.  I had a class in 
Y14.5 a long while ago, and my geometric dimensioning and tolerancing
is pretty rusty.

This is of more than theoretical interest, because we're trying to
decide
when to perform hot solder dip on pure tin components.

Here are some links to the specs for some 25 mil pitch parts, on
the JEDEC website:

http://www.jedec.org/download/search/MO-137C.pdf

http://www.jedec.org/download/search/MO-118b.pdf

What are the max and min lead spacings?  Yes, the lead can change width,
being wider at the top of the package, but I'm more interested in how to
figure this out for a whole family of leaded parts.

-Joe

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