Gloria,

The silver is a thin layer onto copper. When soldering the silver is
immediately dissoved in the solder an in fact you wet on copper.
Copper dissolves very quick in liquid tin. And the opper content will
rise drastically with increasing viscosity. And that is the source of
icicles in lead free wave soldering, ant thus also in selective
soldering. Solution: increase the temperature of the tin up to 275dC
while decreasing the soldering time till about 2.5 seconds.
Succes!

Peer Langeveld
Consultant Soft Soldering Processes

2006/11/14, Gloria Brown <[log in to unmask]>:
> Hi all,
>
>
>
> We have a couple of Selective Solder machines that we use for smaller jobs
> and we are having an issue with all the through hole components coming out
> with solder projections.  The process is lead free using a water soluable no
> clean flux.  The boards are Silver Emersion, Sn100C alloy.  Any suggestions?
>
>
>
>
> GB
>
> phone 906-932-5970  ext. 26
>
> fax  906-932-9822
>
>
>
>
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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