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November 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 13 Nov 2006 10:45:19 -0500
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        Hi Kerry:
        Kapton tape dielectric strength is several thousand volts, about
1 mil thick consistently, will outlast the board, comes in every width
needed.  It is hard to beat that. I would use it.
        Regards,	
        Ramon
	
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gallegos, Luis A.
Sent: Monday, November 13, 2006 8:21 AM
To: [log in to unmask]
Subject: Re: [TN] Power Via Capping

Hi Kerry
How about Urethane, Acrylics or Epoxy as a conformal coat application.
Good luck


Sanmina-sci
Luis Gallegos
Process Engineer
8701 100th Street
Pleasant Prairie, WI 53158

Phone: 262 947-7700
Direct: 262 947-2765
Fax: 262 947-7728
e-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Friday, November 10, 2006 3:11 PM
To: [log in to unmask]
Subject: [TN] Power Via Capping

Hello Esteemed Technet,

Ran into a little issue here.  A board we have has 4 power via's (3.3,
5,
etc) directly under a device that was not supposed to have an grounded
exposed heatsink on the bottom side.  The nasty result is the occasional
short where one of the power vias make contact to the heatsink.  I
cannot drill out these vias as there is trace going from these vias
directly to the pins of the device.

I can use kapton tape to cover the vias, but I was looking for a better
solution.
No soldermasking allowed!

Any ideas?
Thanks in advance,
Kerry



Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832

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