Hi Kerry
How about Urethane, Acrylics or Epoxy as a conformal coat application.
Good luck
Sanmina-sci
Luis Gallegos
Process Engineer
8701 100th Street
Pleasant Prairie, WI 53158
Phone: 262 947-7700
Direct: 262 947-2765
Fax: 262 947-7728
e-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Friday, November 10, 2006 3:11 PM
To: [log in to unmask]
Subject: [TN] Power Via Capping
Hello Esteemed Technet,
Ran into a little issue here. A board we have has 4 power via's (3.3,
5,
etc) directly under a device that was not supposed to have an grounded
exposed heatsink
on the bottom side. The nasty result is the occasional short where one
of
the power vias make contact to the heatsink. I cannot drill out these
vias as there is trace going from these vias directly to the pins of the
device.
I can use kapton tape to cover the vias, but I was looking for a better
solution.
No soldermasking allowed!
Any ideas?
Thanks in advance,
Kerry
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832
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