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November 2006

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From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Thu, 2 Nov 2006 10:21:03 -0500
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So you don't know if you have copper dissolution.

It seems that SAC is OK for controlled soldering like waving. If you can, make a cross section and verify where you are. If OK, just make sure your process is consistent.

Ioan

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, November 02, 2006 10:13 AM
To: [log in to unmask]; Tempea, Ioan
Subject: RE: [TN] Copper Dissolution


Thanks, Ioan

Our surface finishing type is immersion silver , will it be worse for copper dissolution . 
We have no chances to eliminated our TH component .
Do you mean it will be impossible to avoid copper dissolution if we select such design ?

Irving

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, November 02, 2006 11:01 PM
To: [log in to unmask]
Subject: Re: [TN] Copper Dissolution

Lee,

the best solution is to have a PCB re-spin and eliminate the TH. Or decrease the number of TH parts so that you can do intrusive.

Copper dissolution is a function of temperature and time, so you either lower the temperature, lower the wave time, or both.

Now, do you have copper dissolution problems? Have you cross sectioned? If you do have a problem, you might want to try waving with SN100C alloy instead of SAC305. The SN100C is supposed to reduce the copper erosion.

Good luck,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Irving Lee
Sent: Thursday, November 02, 2006 9:45 AM
To: [log in to unmask]
Subject: [TN] Copper Dissolution


 
How to avoid copper dissolution during lead free wave soldering ?

[1] Printed Circuit Board Size : 13"x16" , Thickness : 0.93"
[2] Lead Free  Solder Bar Type : SAC = Sn + 3 % Ag + 0.5 % Cu [3] Both sides Reflow prior to Wave Soldering [4] Wave time : 6 sec , Temperature : 265 degree C


Irving Lee

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