I was just bombarded with emails requesting information on businesses
that perform BGA re-balling or solder sphere attachment. Here are two
companies that perform re-balling that I have experience with here in
the U.S. They both do excellent quality work at what I feel is very
reasonable pricing. There are other companies, just do a google search,
but I have only indirect experience with them.
www.winslowautomation.com and www.analog-tech.com
Talk to Russ Winslow at Winslow Automation. Talk to Don Dahler or Joshua
Muonio at Analog Technologies, Inc.
-----Original Message-----
From: John Burke [mailto:[log in to unmask]]
Sent: Wednesday, November 08, 2006 11:44 AM
To: Stadem, Richard D.
Subject: RE: [LF] EU Not Busting for RoHS Violations Yet
Richard, I am actually needing a vendor for production ball attach. All
I can find locally are people charging re-ball pricing.
Can you give me some contacts please?
As an example I can buy a package with die attach, bonded packaged and
balled for $2.00 from our packaging vendor in Singapore.
I am being quoted $2.00 just for balling here in the valley.
All help gratefully received.
Thanks and kind regards,
John Burke
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, November 08, 2006 9:22 AM
To: [log in to unmask]
Subject: Re: [LF] EU Not Busting for RoHS Violations Yet
For quantities like that, 12,000 to 18,000 BGAs, most component vendors
will provide you with the alloy of your choice. If not, its a no-brainer
that they can provide you with a package without solder balls, and you
can drop-ship them to one of many companies worldwide who perform the
ball attach services. This way you do not have to remove any solder
balls. These same companies are the ones that do the ball-attach for the
component vendors. The component manufacturers seldom do this themselves
anymore. Here in the U.S. many OEMs and CEMs routinely buy their parts
without solder balls, and have the balling done by another company (or
quite often in their own factory) with the sphere size and alloy of
their choice. Many buy solderless BGAs (or equivalent LGA packages, and
there is a difference) and have them soldered to interposers designed to
provide longer reliability lives by providing the part with a more
compliant array to overcome CTE mismatches. There are many examples of
this. Usually a price cut is provided by the component manufacturer if
the components are spec'd without solder.
Find a good component applications engineer and/or buyer or train
someone within your company who can get up to speed on this, both from a
technically savvy and negotiating standpoint. Your company will save
itself a lot of money if you have someone who knows how to handle these
issues up front, _before_ you need the parts to meet contract shipping
schedules.
Another point on the solder ball numbers you just described; if you need
to strip off solder balls from a BGA, a single BGA can have the balls
stripped off, the site prepped, and the part cleaned in less than one
minute per BGA. It does not really matter if it has 10 pads or 1068, the
process is the essentially the same.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of SCHMIDT,
WOLF-DIETER - PFHO
Sent: Wednesday, November 08, 2006 10:24 AM
To: [log in to unmask]
Subject: Re: [LF] EU Not Busting for RoHS Violations Yet
Hello Richard,
in between I've discussed that point directly with Arnaud. What I told
to him I'll like to post here again:
it's no question of technical solution in principle. But how to handle
this in series production as we have to do ?
in production (until yet having BGAs with SnPb but...):
- 2,000 boards with in sum 12,000 to 18,000 BGAs
- round about 600,000 to 1,000,000 balls to be removed
I guess that the costs to reball one BGA might be about the same as the
costs to put all other components on that very board or even higher. The
problem is to find a solution which is acceptable from technical point
of view as well as to fit to series production needs.
Best regards
W.-D. Schmidt
> -----Original Message-----
> From: Stadem, Richard D. [mailto:[log in to unmask]]
> Sent: Wednesday, November 08, 2006 4:19 PM
> To: [log in to unmask]
> Subject: Re: [LF] EU Not Busting for RoHS Violations Yet
>
>
> Thank you for the clarification, Arnaud. I thought the 60% figure was
> quite high, as preforms for re-balling are only $3-$4, as an example.
> Of course there are the labor costs (perhaps 1/2 hour per BGA if done
> singly). I typically have had BGAs re-balled for other customers by an
> outside shop that provides this service at a total cost of about $10
> per BGA.
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Wednesday, November 08, 2006 9:10 AM
> To: [log in to unmask]
> Subject: Re: [LF] EU Not Busting for RoHS Violations Yet
>
> TechNetters,
>
> Being the presenter of the paper cited twice by Werner on TN, I have
> to give some comments about the 60% figure (which is not part of the
> paper BTW). Reballing is an extra process whose costs are very
> supplier and process dependent (e.g.
> with or without tooling costs). It is also widely dependent on the
> component type and the quantity. So, as for any questions dealing with
> costs, it is very difficult to give a figure enclosing everything. The
> one I gave was supposed to give an upper limit viewed from my window.
> Please do not take it as an absolute one. I hope this will bring some
> clarification.
>
> Best regards,
>
> A. Grivon
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