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November 2006

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Subject:
From:
Irving Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 2 Nov 2006 22:44:59 +0800
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How to avoid copper dissolution during lead free wave soldering ?

[1] Printed Circuit Board Size : 13"x16" , Thickness : 0.93"
[2] Lead Free  Solder Bar Type : SAC = Sn + 3 % Ag + 0.5 % Cu 
[3] Both sides Reflow prior to Wave Soldering
[4] Wave time : 6 sec , Temperature : 265 degree C


Irving Lee

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