术语11



 



 Migration Resistance                       迁移阻抗         96.1920

That property of a printed wiring board that resists insulation degradation by electromigration of metal atoms of a conductor under the influence of a difference in electrical potential.

印制线路板抵制变电压影响下金属导体原子的电迁移导致的绝缘退化的特性。

▲抗迁移---印制板抵制在不同电位影响下导体金属原子电迁移而导致绝缘性能下降的特性。

 

Minimum Annular Width                   最小环径         22.0765

The minimum width of metal(s) at the narrowest point between the edge of a hole and the outer edge of a circumscribing land. (This determination is made to the drilled hole on internal layers of multilayer printed boards and to the edge of the plating on external layers of multilayer and double-sided printed boards.)

孔环边缘和焊盘外接面最窄区域额宽度。(此定义适用于多层印制板的内层钻成孔，多层或双面印制板的电镀层边缘。)

▲孔的边缘和焊盘外边缘之间的最窄点处的金属最小宽度。(此定义适用于多层印制板内层的钻孔，多层和双面印制板外层电镀层的边缘。)



Minimum Bump Pitch                        最小凸块间距  36.1921

Minimum pitch between the centers of any two perfectly aligned bumps. 

▲最小凸块间距---任何两个完全在一直线上的凸块中心点之间的最小间距。



 Minimum Electrical Spacing            最小电气间距  21.1451

The minimum allowable distance between adjacent conductors, or between conductors and noncommon conductors such as mounting hardware, ground, etc., at a given voltage and altitude, that is sufficient to prevent dielectric breakdown, corona, or both, from occurring between the conductors.

在特定电压和海拔高度条件下，相邻导体，导体和非导体或贴片硬件或地表之间的最小允许间距。这是为了有效避免导体间的介质击穿和电晕。

▲在规定电压和海拔高度条件下，相邻导体之间，导体与诸如安装的硬件或接地等非公共导体之间的最小允许间距。该参数值足以有效避免导体间的介质击穿和电晕。

 

Minor Defect                                     最小缺陷         91.0767

A defect that is not likely to result in a failure of a unit or product or that does not materially reduce its usability for its intended purpose.

不会导致单元或产品失效或非本质上减少预期目的可用性的缺陷。

▲轻缺陷---不会导致设备或产品失效，或不会导致严重降低其预期可用性的缺陷。

 

Mirrored Pattern                               镜像线路         24.0768

A pattern whose orientation denotes a transposition from right reading. (See Figure M-4.) 方向与右读规则相对的线路(参见图M-4)

▲镜像图形---其方向显示与正读相反的图形。

 



Mis-Pick                                             缺纬                 44.0769

A break in the pattern of cloth from selvage to selvage that is caused by a missing filling yarn.

由于纱填充不足导致的织物织边之间的断层。

▲因纬纱缺漏造成织物纹理结构从织物一边到另一边缺损。

 

Misregistration                                 重合失调         50.0771

Imperfect registration. 

有缺陷的重合。

▲ 重合不良---未完全重合。童晓明tongxm



Mixed Component-Mounting Technology             混合元件贴片技术     70.1452

A component mounting technology that uses both through-hole and surface-mounting technologies on the same packaging and interconnecting structure.

对同种封装和互联结构复合使用通孔和表面贴装的元件贴片技术。

▲混合元件安装技术---在同一封装和互连结构件中使用通孔安装和表面安装技术的元件安装技术。 



Mixed-Effects Model                        混合效果模式  91.0772

An experimental treatment that contains elements of both deterministic effects and random-effects models.

同时包含确定和随即效果模式的实验过程。



▲既包括确定性效果又包括随机性效果模式的实验处理。



童晓明tongxm