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November 2006

TGAsia@IPC.ORG

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Subject:
From:
Charlotte Hao <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
Date:
Thu, 9 Nov 2006 02:45:08 -0600
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Dear All,
 
These are 7 terms which are uncertain this afternoon, please give us your hand. : )
 
Thanks and regards 
 
Charlotte
 

As-Fired                                                共火                        45.0054

The condition (values) of thick-film components or the smoothness of ceramic base materials, after they have been processed in a firing furnace and prior to trimming or polishing.

切削或抛光前在热熔炉中处理的厚膜元件或陶瓷基材的平滑度的条件(数值)。

 

Assembly Manufacturer                   组装制造商            70.1911

The individual, organization, or company responsible for the assembly process and verification operations necessary to ensure full compliance of assemblies.

负责组装过程及必要的检验工作,以确保产品是否完全符合要求的个人、组织或公司。

 

Attachment Density                          连接密度         22.1823

The average number of surface mount or through hole solder joints, based on pitch and land size, that may be accommodated in a prescribed unit area e.g., cm2, considering land size within the unit area to accommodate solder joint attachment.

基于间距和焊盘大小的表面贴装及通孔焊点的平均数量,为了适应焊点连接,考虑到单位面积内的焊盘大小,可在单位面积内如每平方厘米,对其进行调节。

 

Assignable Cause                            不可忽视的原因     91.0059

See "Special Cause."

见“特殊原因”。

 

Automatic Conductor Routing         自动布线         22.0124

Software that automatically determines the placement of interconnections on a printed board.

自动确定印制板上互连布置的软件。

 

Automatic Test Generation              自动测试生成         92.0065

Computer generation of a test program based solely on circuit topology with little or no manual programming effort.

仅基于电路布局技术的测试程序的计算机生成,很少或没有人工编程的参与。

 

B-Stage                                              B阶               41.1343

An intermediate stage in the reaction of a thermosetting resin in which the material softens when heated and swells, but does not entirely fuse or dissolve when it is in contact with certain liquids. (See also "C-Staged Resin.")

热固性树脂反应的中间阶段,其当受热膨胀时材料软化,,但当与某种液体接触时并不完全融化或分解。 (另见”C阶树脂”)

 

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