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November 2006

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Subject:
Re: SnPb attachment of SAC BGAs
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 22 Nov 2006 12:37:00 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Hi Gordon,
First, that the problem is a non-uniform distribution of the Pb does not make
sense. Non-uniform distributions of other constituents is more likely as a
cause of problems [of course, if nothing is uniformly distributed the Pb is
likewise].
Regardless, a peak reflow temperature of 225C is too low, 235C would assure
consistent good wetting quality, which of course means that the PCB reaches
about 260C peak.



Werner

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