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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 2 Nov 2006 12:42:09 -0500 |
Content-Type: | text/plain |
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Dear Technetters,
One of the connectors that we use in an exempt application just went lead free. The surface finish on the connector is gold over nickel. One end of the connector is soldered to the board by tin lead solder, while the other end goes into a PTH and is hand soldered, again using tin-lead solder. How can I be sure that gold embrittlement will not be an issue for this joint? Is there a minimum % of gold that needs to be present in the solder joint for this to become an issue?
If I know the gold plating thickness, pin dimensions, and the PTH dimensions, can I figure out how much gold % would be in the joint, and hence objectively conclude one way or the other? What other information do I need?
Regards,
Amol
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