Hi Pete,
Is there any chance that the boards were bent during the
assembly/handling?
I'll send you a few images later on, so you can compare them with what
you've got.
Regards,
Vladimir
Vladimir Igoshev, Ph.D.
Physical FA Laboratory Manager
Advanced Micro Devices Inc.
Ph: 905-882-2600, x 6611
Fax: 905-882-5536
Cell: 416-300-4203
E-mail: [log in to unmask]
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pete Houwen
Sent: Tuesday, October 31, 2006 4:00 PM
To: [log in to unmask]
Subject: Re: [LF] need some SEM/EDX BGA images
A couple of notes to the original post:
Our board vendor is a known high quality vendor that we've used
flawlessly
for many years. We have another assembly location building these same
boards, same vendor, no problems at all.
The images I have do not show classic black pad. I'm looking for black
pad
images (SEM/EDX) for comparison. They do show P-rich zones, but also Ni
in
the solder bals, and bumps of solder on top of the NiP, in the partially
fractured area.
These boards may be getting heated 4 or 5 times. I can't get an
official
report from them, but I understand the initial 2 reflows use a peak of
265
with an undetermined by extended TAL. I believe may be drawing too much
Ni
out of the bulk pad.
If I have a PCB problem, I want to address it. I think it's more likely
I
have an assembly problem, and they want to dismiss that immediately.
And at the same time, in a separate effort, I'm trying to stop them from
changing to a known poor quality vendor to save a few dollars.
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