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Dear All,
These are 7 terms which are uncertain this afternoon, please give us your opinions. : )
Thanks and regards
Charlotte
Drill Bit 钻头 51.1702
A rod with spiral flutes (grooves) and an obtuse angled point with sharpened cutting edges used to make holes by rotary action.
一种带有螺旋凹槽的杆,头部为带有刃口的钝角尖,通过旋转运动制作孔。
Dry Glass (Clad Laminate) 干玻(覆箔层压板) 41.1706
A general reference to the appearance of a laminate where the reinforcement is highly visible, due to low/lost resin content or poor wetting/encapsulation of the resin to the reinforcement, although the resin coverage is acceptable.
一种层压板外观的常规参照,其中,由于树脂含量低/损失或树脂对增强材料的润湿/密封不良,使得增强材料非常明显,尽管树脂覆盖率是可接受的。
Embedded Fiber (Base Materials) 埋纤(基材) 44.1825
An inclusion which has an insignificant width or diameter but has significant length, usually but not always in a curly or twisted configuration, generally from organic sources such as clothing or packaging materials.
一种宽度或直径可忽略、但长度较明显的夹杂物,通常为但不总是弯曲或扭曲外形,一般源于有机物,如布料或包装材料。
Equilibrium Wetting 平衡润湿法 75.1722
The degree of wetting in which the forces of wetting are in equilibrium with the forces of gravity. The visible indication of this is the wetting balance curve describing the wetting action when the rate of change approaches zero.
润湿力与重力处于平衡状态下的润湿程度。可用变化率趋近于0时的润湿平衡曲线直观表示润湿作用大小。
Eutectic Die Attach 共晶芯片贴装 74.0454
The mounting of a semiconductor die to a base material with a preform of a eutectic metal alloy that is brought to its eutectic melting temperature.
采用达到共晶熔融融温度的共晶金属合金预成型焊料,将半导体芯片安装到基材上的过程。
Embedded Copper (Base Materials) 埋铜(基材) 45.1718
An inclusion which is composed of copper and sourced from the cladding, and may be particles from treatment transfer, broken away copper tooth, or spurious copper.
源于覆层的由铜组成的夹杂物,可能是处理转移的铜颗粒、断裂的铜刺,也可能是假铜。
End Mill 端铣刀 51.1719
A rod with straight or spiral flutes (grooves) sharpened as a cutting surface(s) and a flat or shaped end with cutting teeth, used for surface or side milling by rotary action.
一种带有垂直或螺旋状凹槽的滚筒,被削尖成锋利的表面和平的或某种形状的端部,带有锋利的牙齿,通过旋转运动用作表面或侧面研磨。
Entry/Backup Material 引入/支持材料 51.1720
A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
在钻孔或布板时,放置于一叠印制板的顶部(引入)和/或底部(支持),支撑钻孔边缘或切板侧面,以便将毛刺减少到最低的材料。
Exposure Time (Component) 曝露时间(元器件) 30.1914
The compensation factor which accounts for the time after bake that the component manufacturer requires to process the components prior to bag seal.
烘烤后用于时间考量的补偿因素,元器件制造商要求在装入密封袋前处理元器件。
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