Sender: |
|
X-To: |
|
Date: |
Wed, 1 Nov 2006 14:16:59 +0800 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
base64 |
Content-Type: |
text/plain; charset="gb2312" |
From: |
|
Parts/Attachments: |
|
|
Metal Migration 金属迁移 96.1445
The electrolytic transfer of metal ions along an electrically conductive path from one metal surface to another when an electrical potential is applied to the two metal surfaces.
当电压作用于两个金属表面时,金属离子在电解作用下 沿着 导电通路从一金属表面迁移到另一金属表面。
Metallized Land Areas 金属化焊盘区域 22.1756
A pattern of conductive material used on a substrate to interconnect electronic components. Widened conductor areas used as attachment point for wire bonding or other devices.
基板上用以实现电子元器件互连的导电材料图形。加宽的导体区域用作导线 键合 或其他器件的连接点。
----- Original Message -----
From: "Charlotte Hao" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 31, 2006 11:19 AM
Subject: [TGA] Today's terms
Dear All,
Today there are two terms which are uncertain, would you like to help us?
Thanks and regards
Charlotte
Metal Migration 金属迁移 96.1445
The electrolytic transfer of metal ions along an electrically conductive path from one metal surface to another when an electrical potential is applied to the two metal surfaces.
当电压作用于两个金属表面时,金属离子在电解作用下通过电气导电通路从一金属表面迁移到另一金属表面。
Metallized Land Areas 金属化焊盘区域 22.1756
A pattern of conductive material used on a substrate to interconnect electronic components. Widened conductor areas used as attachment point for wire bonding or other devices.
基板上用以实现电子元件互连的导电材料图形。加宽的导体区域用作导线绑定或其他器件的连接点。
|
|
|