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Mixed Technology 混合技术 70.1757
In surface mounting, refers to mixing through hole component and surface mounting components on the same side of a printed circuit board.
在表面贴装中，对印制板同一面复合使用通孔和表面贴装元件的技术。
▲在表面贴装中，在印制板同一面上既采用通孔安装元器件，又采用表面贴装元器件的技术。
Modification 修正 77.0774
The revision of the functional capability of a product in order to satisfy new acceptance criteria.
修改产品功能性能力来满足新的接收标准。
▲为满足新的接收标准而对产品功能性能力的修改。
Module 模块 80.0775
A separable unit in a packaging scheme. 封装体系中的可分离单元。
▲封装配置/计划中的可分离的单元。
Module Board 模块板 67.1922
A substrate on which bare die and surface-mount components are attached and interconnected intended to be further assembled to a product planar board.
一块预先组装了模具和表面贴装元件的基板，为进一步组装成品板作准备。
▲一块预先组装了裸芯片和表面贴装元器件的基板，以便进一步组装成品板。
Moisture Absorption 吸潮量 40.1923
Under specified test conditions, the weight percentage of moisture absorbed by a material.
特定测试条件下，物质吸收的潮湿比重
▲在规定的测试条件下，材料所吸潮汽的重量百分比。
Moisture Barrier Bag (MBB) 防潮袋 30.1924
A bag that is electrostatic discharge (ESD) safe and is designed to restrict the ingress of water vapor used to package moisture-sensitive devices.
用来包装潮湿敏感元器件的防静电且防止水蒸气侵入的袋子。
▲用来包装湿敏器件的防静电且防水汽侵入的袋子。
Moisture Resistance 防潮力 40.1925
The measure of how well the insulation characteristics of a material are maintained when exposed to temperature and humidity.
物质暴露在温湿度环境下维持原有特性能力的测量。
▲对暴露于温度和湿度环境下的材料维持原有绝缘特性能力的测量。
Molded Interconnection Device 铸型互联器件 67.1926
A combination of molded plastic substrate and conductive patterns that provide both the mechanical and electrical functions of an electronic interconnection package. 铸型塑料基材和用来提供电子互联组件机械及电子功能的导电图层的组合。
▲模塑互连器件 --- 模塑基片和导电图形的组合件，它能为电子互联封装既提供机械功能又电气功能。
▲ Molecular Dye-Imaging Material 分子染色成像材料 24.0776
Monolithic Integrated Circuit 单片式集成电路 30.0777
An integrated circuit in the form of a monolithic structure.
以单块集成电路为形式的集成电路。
▲单片集成电路---单片结构形式的集成电路。
tongxm
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